0.5W 3528 SMD LED


1. Features

• High-luminosity SMD LED
• 3.5 mm x 2.8 mm x 0.8 mm (L x W x H) Small Size Surface Mount Type
• Wide Viewing Angle
• Long Operating Life

2. Applications

• Automotive: Backlight in Dashboard and Switch
• General Lighting
• General Use
3. Outline Drawing and Dimension

Note
1. All dimensions are in millimeters
2. All dimensions without tolerances are for reference only

4. Absolute Maximum Ratings ( Ta = 25 ℃ )
Parameter Symbol Value Unit
Power Dissipation per Chip Pd 540 mW
Continuous Forward Current

IF

150

mA

Peak Forward Current ※1

IFP

300

mA

Operating Temperature

Topr

-30 ~ +85

Storage Temperature

Tstg

-40 ~ +100

Soldering Temperature

Tsol

260 (5sec)

※1 Duty ratio = 1/10, Pulse width = 10ms

5. Electrical & Optical Characteristics (Ta : 25℃)


Parameter

Symbol

Conditions

Min.

Typ. MAX.

Unit.

Forward Voltage

VF

IF = 150mA

2.8

3.2

3.6

V

Reverse Voltage

VR

IR= 5mA

0.7

0.8

1.5

V

Color Coordinates CIE x
CIE y

IF = 150mA

Refer to Color Coordinates Rank

 
Luminous Flux※2

ΦV

IF = 150mA

24

-

50

lm

Viewing Angle※3 1/2<

IF = 150mA

-

130

-

deg

※2 Luminous Flux is measured with an integrating sphere and has an accuracy of 10%.
※3 Viewing Angle is the angle until 50% of brightness measured from the front part of LED.


5.1 Luminous Flux Rank 5.2 Forward Voltage Rank
Rank

Luminous Flux (lm)

H

24 ~ 29

J

29 ~ 35

K

35 ~ 42

L

42 ~ 50

Rank

Forward Voltage (V)

0

2.8 ~ 3.0

2

3.0 ~ 3.2

4

3.2 ~ 3.4

6

3.4 ~ 3.6


5.3 Color Coordinates Rank ( IF = 150 mA, Ta = 25 ℃ )
BW CW

Rank Z1

Rank Z2

Rank  A1

Rank A2

 Rank B1

Rank B2
CIE x CIE y CIE x CIE y CIE x CIE y< CIE x CIE y CIE x CIE y CIE x CIE y
0.2400 0.2000 0.2500 0.2100 0.2600 0.2200 0.2700 0.2300 0.2800 0.2400 0.2900 0.2500
0.2400 0.2600 0.2500 0.2700 0.2600 0.2800 0.2700 0.2900 0.2800 0.3000 0.2900 0.3100
0.2500 0.2700 0.2600 0.2800 0.2700 0.2900 0.2800 0.3000 0.2900 0.3100 0.3000 0.3200

0.2500

0.2100

0.2600 0.2200

0.2700

0.2300

0.2800 0.2400 0.2900

0.2500

0.3000

0.2600



PW

 Rank Y

 Rank Z

Rank  A

 Rank B

  Rank C

CCT(K) 8000~7000 CCT(K) 7000~6500 CCT(K) 6500~6000 CCT(K) 6000~5500 CCT(K) 5500~5000
CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
0.3092 0.2600 0.3160 0.2700 0.3208 0.2764 0.3265 0.2830 0.3340 0.2900
0.2870 0.3300 0.2995 0.3490 0.3090 0.3600 0.3190 0.3698 0.3315 0.3800
0.2995 0.3490 0.3090 0.3600 0.3190 0.3698 0.3315 0.3800 0.3470 0.3900
0.3160 0.2700 0.3208 0.2764 0.3265 0.2830 0.3340 0.2900 0.3425 0.2990

NW

  Rank D

 Rank  E

 Rank F

  Rank G

   Rank H

CCT(K)

5000~4500

CCT(K)

4500~4200

CCT(K)

4200~4000

CCT(K)

4000~3800

CCT(K)

3800~3600

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
0.3425 0.2990 0.3540 0.3100 0.3625 0.3180 0.3692 0.3235 0.3762

0.3290

0.3470 0.3900 0.3655 0.4000 0.3775 0.4050 0.3872 0.4085 0.3970 0.4121
0.3655 0.4000 0.3775 0.4050 0.3872 0.4085 0.3970 0.4121 0.4080 0.4160
0.3540 0.3100 0.3625 0.3180 0.3692 0.3235 0.3762 0.3290 0.3840 0.3350

WW

  Rank J

Rank  K

 Rank P

   Rank Q

   Rank R

CCT(K)

3600~3400

CCT(K)

3400~3200

CCT(K)

3200~3000

CCT(K)

3000~2800

CCT(K)

2800~2600

CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y
0.3840

0.3350

0.3940 0.3433 0.4045 0.3500

0.4155

0.3550 0.4280

0.3600

0.4080

0.4160

0.4195

0.4200

0.4155

0.3550

0.4280

0.3600

0.4420

0.3650

0.4195

0.4200

0.4330

0.4248 0.4479

0.4295

0.4640

0.4335

0.4820

0.4365

0.3940

0.3433

0.4045

0.3500

0.4330

0.4248

0.4479

0.4295

0.4640

0.4335


6. Typical Characteristic Curve

7. Dimension of Tape / Reel

7.2 Reel Dimension

9. Precaution in use

9.1 Soldering Conditions

When soldering Power SMD, Heat may affect the electrical and optical characteristics of  the LEDs.
In soldering, do not stress the lead frame and the resin part under the high temperature
The silicone part should be protected from mechanical stress or vibration until the Power SMD return to room temperature after soldering.
Preliminary heating to be at 160 ℃ max. for 120 Seconds max.
Soldering heat to be at 260 ℃ max. for 5 sec. Max.
For manual Soldering is Not more than 3 sec @MAX 350 ℃, under soldering iron

9.2 Storage

Before opening the package, the LEDs should be kept at 30℃ or less and 70%RH or less.
The LEDs should be used within a year.
After opening the package, the LEDs should be kept at 30℃ or less and 30%RH or less.
The LEDs should be used within 572 hours (4 Week) after opening the package.
If the moisture absorbent material (silicagel) has faded away or the LED have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment: 60℃±5 for 72 hours.

9.3 Static Electricity

Static electricity or surge voltage damages the Power SMD . It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs
A tip soldering iron is requested to be grounded. An ionizer should also be installed where risk of static.
All devices, equipment and machinery must be properly grounded (via 1MΩ). It is recommended that measures be taken against surge voltage to the equipment that mounts the Power SMD.

9.4 Cleaning 

Isopropyl Alcohol or Ethylene Alcohol is recommended in 5 minutes at room temperature.
Don’t use unspecified chemical may cause crack or haze on the surface of the epoxy resin.
Before cleaning, a pre-test should be done to confirm whether any damage to the LED will occur.
Freon solvents should not be used to clean the LEDs because of worldwide regulations.

9.5 Heat generation 

When the LEDs are illuminating, operating current should be decided after being considering the ambient maximum temperature.
Please consider the heat generation of the LED when it is designed the PCB.
The LED’s must be mounted on MCPCB or heat sink or applied thermal pad.

 

 

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